Display device

ABSTRACT

A display device includes a display panel that includes a concave portion at a side of the display panel; and an input detection unit disposed over the display panel. The input detection unit includes a plurality of first detection electrodes electrically connected to each other in a first direction, a plurality of second detection electrodes electrically connected to each other in a second direction perpendicular to the first direction, and a connection wire that electrically connect a pair of the first detection electrodes of the plurality of first detection electrodes disposed at both sides of the concave portion, and the connection wire includes a plurality of segments separate from each other and conjunction portions that electrically connect two adjacent segments to each other.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 from, and thebenefit of, Korean Patent Application No. 10-2018-0090692, filed on Aug.3, 2018 in the Korean Intellectual Property Office, the contents ofwhich are herein incorporated by reference in their entirety.

BACKGROUND 1. Technical Field

One or more embodiments are directed to a display device, and moreparticularly, to a display device that includes an input detection unit.

2. Discussion of the Related Art

Various display devices used in a multimedia apparatuses such astelevisions, cellular phones, tablet computers, navigation systems, gamemachines, etc., are being developed. The display devices include akeyboard, a mouse, etc., as input devices. The display devices alsoinclude a touch panel as an input device.

SUMMARY

One or more embodiments include a display device that includes an inputdetection unit that can prevent defects from occurring due toelectrostatic discharge.

According to one or more embodiments, a display device includes: adisplay panel that includes a concave portion at a side of the displaypanel; and an input detection unit disposed over the display panel,wherein the input detection unit includes a plurality of first detectionelectrodes electrically connected to each other in a first direction, aplurality of second detection electrodes electrically connected to eachother in a second direction perpendicular to the first direction, and aconnection wire that electrically connects a pair of the first detectionelectrodes disposed at both sides of the concave portion, and theconnection wire includes a plurality of segments separate from eachother and conjunction portions that electrically connect two adjacentsegments to each other.

The input detection unit may further include a connector that connectstwo adjacent first detection electrodes, and a bridge electrode thatconnect two adjacent second detection electrodes, the connector may bedisposed on a same layer as that of the first detection electrodes andthe second detection electrodes, and the bridge electrode may bedisposed on a different layer from that of the first detectionelectrodes and the second detection electrodes, and the conjunctionportion may be disposed on a same layer as that of the first detectionelectrodes and the second detection electrodes, and the plurality ofsegments may be disposed on a same layer as that of the bridgeelectrode.

The input detection unit may further include a first insulating layerbetween the bridge electrode and the second detection electrodes andbetween the segments and the conjunction portion, and the bridgeelectrode may be connected to the second detection electrodes via firstcontact holes formed in the first insulating layer, and the segments maybe connected to the conjunction portions via second contact holes formedin the first insulating layer.

The bridge electrode may be disposed on a layer lower than that of thesecond detection electrodes, the input detection unit may furtherinclude a second insulating layer disposed over the conjunction portion,and a refractive index of the first insulating layer may be less arefractive index that of the second insulating layer.

The input detection unit may include a touch area in which the pluralityof first detection electrodes and the plurality of second detectionelectrodes are disposed, and the connection wire may be disposed outsidethe touch area.

The input detection unit may include a connection line connected to theplurality of first detection electrodes or the plurality of seconddetection electrodes, and a dummy line in a floating state, where theconnection line and the dummy line may be disposed outside the toucharea, and the dummy line may be disposed between the connection line andthe connection wire.

The dummy line may include a cut portion obtained by removing a part ofthe dummy line, and the plurality of segments respectively furthercomprise an expanded portion that may extend from the end of theplurality of segments into the cut portion.

The input detection unit may be disposed directly on the display panel.

The display panel may include an organic light-emitting device.

According to one or more embodiments, a display device includes: adisplay panel that includes a concave portion at a side of the displaypanel; and an input detection unit disposed over the display panel,wherein the input detection unit includes a plurality of first detectionelectrode arrays in which a plurality of first detection electrodes areelectrically connected to each other and extend parallel to each otherin a first direction, and the plurality of first detection electrodearrays are spaced apart from each other in a second directionperpendicular to the first direction, a first detection electrode arrayof the plurality of first detection electrode arrays is cut by theconcave portion and includes a pair of first detection electrodesdisposed at both sides of the concave portion, and the pair of firstdetection electrodes are electrically connected to each other via aconnection wire that bypasses the concave portion, and a resistancevalue of the cut first detection electrode array is identical to aresistance value of the other detection electrode arrays of theplurality of first detection electrode arrays in which the firstdetection electrodes are consecutively disposed.

The connection wire may include a plurality of separate segments, andconjunction portions that electrically connect adjacent segments ofplurality of separate segments to each other.

The input detection unit may include a touch area in which the pluralityof first detection electrodes are disposed, and the connection wire maybe disposed outside the touch area.

The input detection unit may further include a plurality of seconddetection electrodes electrically connected to each other in the seconddirection.

The input detection unit may further include a connection line connectedto the plurality of first detection electrodes or the plurality ofsecond detection electrodes, and a dummy line in a floating state thatmay be disposed outside the touch area, where the dummy line may bedisposed between the connection line and the connection wire.

The dummy line may include a cut portion obtained by removing a part ofthe dummy line, and the plurality of segments may respectively furtherinclude an expanded portion that may extend from the end of theplurality of segments into the cut portion.

The input detection unit may further include a connector that connectstwo adjacent first detection electrodes, and a bridge electrode thatconnects two adjacent second detection electrodes, where the connectormay be disposed on a same layer as that of the first detectionelectrodes and the second detection electrodes, and the bridge electrodemay be disposed on a different layer from that of the second detectionelectrodes, and the conjunction portion may be disposed on a same layeras that of the first detection electrodes and the second detectionelectrodes, and the plurality of segments are disposed on a same layeras that of the bridge electrode.

The input detection unit may further include a first insulating layerbetween the bridge electrode and the second detection electrodes andbetween the plurality of segments and the connector, and the bridgeelectrode may be connected to the second detection electrodes via firstcontact holes formed in the first insulating layer, and the plurality ofsegments may be connected to the connector via second contact holesformed in the first insulating layer.

The bridge electrode may be disposed on a layer lower than that of thesecond detection electrodes, the input detection unit may furtherinclude a second insulating layer disposed over the conjunction portion,and a refractive index of the first insulating layer may be less than arefractive index of the second insulating layer.

The display panel may include an organic light-emitting device and anencapsulation layer that protects the organic light-emitting device, andthe input detection unit may be disposed directly on the encapsulationlayer.

According to one or more embodiments, a display device includes: adisplay panel that includes a concave portion at a side of the displaypanel; and an input detection unit disposed over the display panel. Theinput detection unit includes a plurality of first detection electrodeselectrically connected to each other in a first direction and spacedapart from each other in a second direction perpendicular to the firstdirection, a plurality of second detection electrodes electricallyconnected to each other in the second direction, a connection wire thatelectrically connects a pair of the first detection electrodes disposedat both sides of the concave portion that are separated by the concaveportion, a connector that connects two adjacent first detectionelectrodes, and a bridge electrode that connect two adjacent seconddetection electrodes. The connector is disposed on a same layer as thatof the first detection electrodes and the second detection electrodes,and the bridge electrode is disposed on a different layer from that ofthe second detection electrodes.

BRIEF DESCRIPT ON OF THE DRAWINGS

FIG. 1 is a schematic plan view of a display device according to anembodiment.

FIG. 2 is a schematic plan view of an example of a display panel of thedisplay device of FIG. 1.

FIG. 3 is a schematic cross-sectional view of a display panel of FIG. 2taken along lines I-I′ and line II-II′.

FIG. 4 is a schematic plan view of part A of FIG. 1.

FIG. 5 is a schematic cross-sectional view of a display panel of FIG. 4taken along a line III-III′.

FIG. 6 is a schematic plan view of part B of FIG. 1.

FIG. 7 is a schematic plan view of part C of FIG. 6.

FIG. 8 is a schematic cross-sectional view of a display panel of FIG. 7taken along a line IV-IV′.

FIGS. 9 and 10 are schematic plan views of other examples of part C ofFIG. 6.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals may refer to like elements throughout. In this regard,embodiments may have different forms and should not be construed asbeing limited to the descriptions set forth herein. Accordingly,embodiments are merely described below, by referring to the figures, toexplain aspects of the present description. The present disclosure may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein.

It will be understood that when a layer, region, or component isreferred to as being “formed on,” another layer, region, or component,it can be directly or indirectly formed on the other layer, region, orcomponent.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation.

Hereinafter, embodiments will be described in detail with reference tothe accompanying drawings. Like reference numerals may denote likeelements throughout the drawings.

FIG. 1 is a schematic plan view of a display device 10 according to anembodiment. FIG. 6 is a schematic plan view of part B of FIG. 1.

Referring to FIG. 1, according to an embodiment, the display device 10includes a display panel 100 and an input detection unit 200 disposedabove the display panel 100. In addition, the display device 10 includesa concave portion T that has a side that is recessed inward from an edgeof the display device 10. In other words, the display panel 100 and theinput detection unit 200 have a side that is recessed in correspondencewith that of the concave portion T of the display device 10. A componentthat expands functionality of the display device 10, such as a cameramodule, a speaker, a sensor, etc., can be disposed in the concaveportion T.

According to an embodiment, the display panel 100 displays an image. Theinput detection unit 200 includes first detection electrodes 210 andsecond detection electrodes 230 that can detect a contact with anexternal touch input unit such as a user's hand or a pen, therebygenerating an input signal.

According to an embodiment, first detection electrodes 210 are connectedto each other in a first direction D1 to form a plurality of firstdetection electrode arrays 210-1 and 210-2 that extend parallel to eachother in the first direction D1. In addition, the plurality of firstdetection electrode arrays 210-1 and 210-2 are spaced apart from eachother in a second direction D2 perpendicular to the first direction D1.

According to an embodiment, the first detection electrodes 210 in aregion near the concave portion T are prevented from being consecutivelydisposed in the first direction D1 by the concave portion T. Forexample, when the concave portion T extends to a position of the firstdetection electrode array 210-1, a pair of the first detectionelectrodes 210 positioned at both sides of the concave portion T are notdirectly connected to each other. Accordingly, in an embodiment, aconnection wire 250 shown in FIG. 6 that bypasses the concave portion Tis used to electrically connect the pair of first detection electrodes210 to each other.

According to an embodiment, a width of the connection wire 250 of FIG. 6can be adjusted so that a resistance value of the first detectionelectrode array 210-1 that includes the pair of first detectionelectrodes 210 electrically connected to each other via the connectionwire 250 is same as that of the other first detection electrode array210-2 in which the first detection electrodes 210 are consecutivelydisposed.

According to an embodiment, the second detection electrodes 230 aredisposed between the first detection electrodes 210 and are connected toeach other in the second direction D2 and extend parallel to each otherin the second direction D2. Accordingly, since consecutive connectionsof the second detection electrodes 230 are not obstructed by the concaveportion T, a bypass wire for electrically connecting the seconddetection electrodes 230 to each other is not needed.

According to an embodiment, FIG. 1 shows an example in which the firstdetection electrodes 210 and the second detection electrodes 230 have adiamond shape. However, the first detection electrodes 210 and thesecond detection electrodes 230 are not limited thereto, and may havevarious shapes.

FIG. 2 is a schematic plan view of an example of a display panel 100 ofthe display device 10 of FIG. 1. FIG. 3 is a schematic cross-sectionalview of an example of the display panel 100 of FIG. 2 taken along linesI-I′ and line II-II′.

Referring to FIGS. 2 and 3, according to an embodiment, the displaypanel 100 has a concave portion T1 having a side that is recessed inwardfrom an edge of the display panel 100, in correspondence with theconcave portion T of FIG. 1. The display panel 100 has a display area DAthat displays an image and a peripheral area PA disposed outside thedisplay area DA that surrounds the display area DA. The peripheral areaPA includes a pad area PADA to which various electric devices or printedcircuit boards are electrically attached, and voltage lines 410 and 420are disposed in the peripheral area PA. The side of the display panel100 having the concave portion T1 is opposite to that of the pad areaPADA.

According to an embodiment, FIG. 2 is a plan view of the substrate 101when the display panel 100 is manufactured. In the finished displaypanel 100 or an electronic device such as a smartphone, etc., thatincludes the display panel 100, a part of the substrate 101, etc., isbent to minimize an area of the peripheral area PA recognized by a user.For example, the substrate 101 is bent between the pad area PADA and thedisplay area DA so that at least a part of the pad area PADA overlapsthe display area DA. A bent direction is determined so that the pad areaPADA does not cover the display area DA but is positioned behind thedisplay area DA. Accordingly, a user can recognize that the display areaDA occupies a greater part of the display device 10 of FIG. 1.

In addition, according to an embodiment, left and right edges of thedisplay area DA are bent to protrude outwards. Thus, when the displaydevice 10 of FIG. 1 is viewed from the front, neither side edge of thedisplay device 10 of FIG. 1 will include a bezel, with an effect ofexpanding the display area DA.

FIG. 3 is a schematic cross-sectional view of a part of the displaypanel 100 of FIG. 2. In FIG. 3, the display panel 100 is an organiclight-emitting display panel that includes an organic light-emittingdevice 310. However, embodiments of the present disclosure are notlimited thereto. The display panel 100 may include other types ofdisplay devices, such as a liquid crystal device.

According to an embodiment, the substrate 101 is formed of, for example,a transparent glass that uses silicon dioxide (SiO₂) as a maincomponent. However, the substrate 101 is not limited thereto, and may beformed of a plastic. The plastic includes a polymer resin such aspolyethersulphone, (PES), polyacrylate (PAR), polyetherimide (PEI),polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate(PC), or cellulose acetate propionate (CAP). Alternatively, thesubstrate 101 can be variously modified, for example, to include ametal, etc.

According to an embodiment, a thin-film transistor TFT is disposed inthe display area DA of the substrate 101. In addition to the thin-filmtransistor TFT, the organic light-emitting device 310 electricallyconnected to the thin-film transistor TFT is disposed in the displayarea DA. In particular, a pixel electrode 311 of the organiclight-emitting device 310 is connected to the thin-film transistor TFT.A thin-film transistor is also disposed in the peripheral area PA of thesubstrate 101. The thin-film transistor in the peripheral area PA maybe, for example, a part of a circuit that controls an electrical signaltransmitted to the display area DA.

According to an embodiment, the thin-film transistor TFT includes asemiconductor layer 111 that includes amorphous silicon, polycrystallinesilicon, or an organic semiconductor material, a gate electrode 113, asource electrode 115 a, and a drain electrode 115 b. A buffer layer 110formed of an inorganic material such as silicon oxide, silicon nitride,or silicon oxynitride, etc., is disposed on the substrate 101 toplanarize a surface of the substrate 101 or prevent impurities frompenetrating into the semiconductor layer 111. The semiconductor layer111 is disposed on the buffer layer 110.

According to an embodiment, the gate electrode 113 is disposed on thesemiconductor layer 111. According to a signal received by the gateelectrode 113, the source electrode 115 a is electrically connected tothe drain electrode 115 b. The gate electrode 113 includes, for example,one or more of aluminum (Al), platinum (Pt), palladium (Pd), silver(Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium(Ir), chrome (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium(Ti), tungsten (W), or copper (Cu). The gate electrode 113 may have asingle-layered or multi-layered structure. To insulate the semiconductorlayer 111 from the gate electrode 113, a gate insulating layer 121formed of an inorganic material such as silicon oxide, silicon nitride,or silicon oxynitride, etc., is disposed between the semiconductor layer111 and the gate electrode 113.

According to an embodiment, an interlayer insulation layer 131 isdisposed on the gate electrode 113. The interlayer insulation layer 131is formed of an inorganic material such as silicon oxide, siliconnitride, or silicon oxynitride, etc., and may have a single-layered ormulti-layered structure.

According to an embodiment, the source electrode 115 a and the drainelectrode 115 b are disposed on the interlayer insulation layer 131. Thesource electrode 115 a and the drain electrode 115 b are bothelectrically connected to the semiconductor layer 111 via a contact holeformed in the interlayer insulation layer 131 and the gate insulatinglayer 121. The source electrode 115 a and the drain electrode 115 binclude, for example, one or more of Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir,Cr, Li, Ca, Mo, Ti, W, or Cu, depending on a desired conductivity, etc.The source electrode 115 a and the drain electrode 115 b may have asingle-layered or multi-layered structure.

According to an embodiment, to protect the thin-film transistor TFThaving such a structure, a protective layer is disposed that covers thethin-film transistor TFT. The protective layer is formed of an inorganicmaterial such as silicon oxide, silicon nitride, or silicon oxynitride,etc. The protective layer may include a single layer or multiple layers.

According to an embodiment, a planarization layer 140 is disposed overthe protective layer. For example, as shown in FIG. 3, when the organiclight-emitting device 310 is disposed above the thin-film transistorTFT, the planarization layer 140 planarizes a whole upper surface of theprotective layer that covers the thin-film transistor TFT. Theplanarization layer 140 includes, for example, an organic material suchas acryl, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO), etc.FIG. 3 shows the planarization layer 140 as having a single layer.However, embodiments are not limited thereto, and the planarizationlayer 140 may include multiple layers.

In a current embodiment, the display panel 100 may include both theprotective layer and the planarization layer 140, or include just theplanarization layer 140 as needed.

According to an embodiment, in the display area DA of the substrate 101,the pixel electrode 311, an intermediate layer 315 that includes alight-emitting layer, and an opposite electrode 313 are disposed on theplanarization layer 140.

According to an embodiment, an opening that exposes at least one of thesource electrode 115 a and the drain electrode 115 b is formed in theplanarization layer 140. The pixel electrode 311 is disposed on theplanarization layer 140 and contacts either the source electrode 115 aor the drain electrode 115 b via the opening, to be electricallyconnected to the thin-film transistor TFT. The pixel electrode 311 mayinclude a (semi)transparent electrode or a reflective electrode. Whenthe pixel electrode 311 is a (semi)transparent electrode, the pixelelectrode 311 includes at least one of indium tin oxide (ITO), indiumzinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium galliumoxide (IGO) or aluminum zinc oxide (AZO). When the pixel electrode 311is a reflective electrode, the pixel electrode 311 has a reflectivelayer formed of at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr,or a compound thereof, etc., and a layer formed of ITO, IZO, ZnO, In₂O₃,IGO, or AZO. However, embodiments of the present disclosure are notlimited thereto, and the pixel electrode 311 may include various othermaterials. The pixel electrode 311 may also have a single-layered ormulti-layered structure.

According to an embodiment, a pixel-defining layer 150 is disposed onthe planarization layer 140. The pixel-defining layer 150 has an openingthat corresponds to each subpixel, that is, an opening that exposes atleast a central portion of the pixel electrode 311, that forms a pixel.In addition, in the case shown in FIG. 3, the pixel-defining layer 150prevents generation of arcs, etc., at edges of the pixel electrode 311by increasing a distance between the edges of the pixel electrode 311and the opposite electrode 313 above the pixel electrode 311. Thepixel-defining layer 150 includes, for example, an organic material suchas PI or HMDSO, etc.

According to an embodiment, the intermediate layer 315 of the organiclight-emitting device 310 includes a low-molecular weight or polymermaterial. When the intermediate layer 315 includes a low-molecularweight material, the intermediate layer 315 has a stacked structure thatincludes a hole injection layer (HIL), a hole transport layer (HTL), anemission layer (EML), an electron transport layer (ETL), or an electroninjection layer (EIL), etc., and includes various organic materials suchas copper phthalocyanine (CuPc),N,N′-Di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB), ortris-8-hydroxyquinoline aluminum (Alq3), etc. Such layers can be formedby a vacuum deposition method.

According to an embodiment, when the intermediate layer 315 includes apolymer material, the intermediate layer 315 has a structure thatincludes, for example, an HTL and an EML. The HTL includespoly-(2,4)-ethylene-dihydroxy thiophene (PEDOT), and the EML includes apolymer material such as poly-phenylenevinylene (PPV) or polyfluorene,etc. The intermediate layer 315 may be formed by a screen printing orinkjet printing method, a laser induced thermal imaging (LITI) method,etc.

However, according to embodiments, the intermediate layer 315 is notlimited thereto, and may have various other structures.

According to an embodiment, the opposite electrode 313 is disposed overthe display area DA. As shown in FIG. 3, the opposite electrode 313covers the display area DA. That is, the opposite electrode 313 isformed as one body with respect to a plurality of the organiclight-emitting devices 310 and corresponds to a plurality of the pixelelectrodes 311. The opposite electrode 313 may include a(semi)transparent electrode or a reflective electrode. When the oppositeelectrode 313 includes a (semi)transparent electrode, the oppositeelectrode 313 includes a layer formed of a metal with a low workfunction, such as Li, Ca, lithium-fluoride-calcium (LiF/Ca),lithium-fluoride-aluminum (LiF/Al), Al, Ag, Mg, or a compound thereof,and a (semi)transparent conductive layer formed of ITO, IZO, ZnO, orIn₂O₃, etc. When the opposite electrode 313 includes a reflectiveelectrode, the opposite electrode 313 includes a layer formed of atleast one of Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, or a compound thereof.However, embodiments are not limited thereto, and the opposite electrode313 can be variously modified with other structures and materials.

According to an embodiment, since a display device such as the organiclight-emitting device 310 includes the opposite electrode 313, a presetelectrical signal needs to be transmitted to the opposite electrode 313to display an image. Accordingly, an electrode power-supply line 420 isdisposed in the peripheral area PA to transmit the preset electricalsignal to the opposite electrode 313.

According to an embodiment, when various conductive layers are formed inthe display area DA, the electrode power-supply line 420 is formed of asame material as that of the conductive layers and at the same time asthe conductive layers. FIG. 3 shows that the electrode power-supply line420 is disposed on the interlayer insulating layer 131 in the peripheralarea PA, like the source electrode 115 a and the drain electrode 115 bof the thin-film transistor TFT, which are disposed on the interlayerinsulating layer 131 in the display area DA. In this case, when thesource electrode 115 a and the drain electrode 115 b are formed on theinterlayer insulating layer 131 in the display area DA, the electrodepower-supply line 420 is formed on the interlayer insulating layer 131in the peripheral area PA of a same material as that of the sourceelectrode 115 a and the drain electrode 115 b and at the same time asthe source electrode 115 a and the drain electrode 115 b. Accordingly,the electrode power-supply line 420 has a same structure as that of thesource electrode 115 a and the drain electrode 115 b. However,embodiments of the present disclosure are not limited thereto. Variousmodifications may be made, such as forming the electrode power-supplyline 420 on the gate insulating layer 121 using a same material as thatof the gate electrode 113 and at the same time as the gate electrode113.

According to an embodiment, the opposite electrode 313 does not directlycontact the electrode power-supply line 420, but is electricallyconnected to the electrode power-supply line 420 via a protectiveconductive layer 422, as shown in FIG. 3. That is, the protectiveconductive layer 422 is disposed on the planarization layer 140 andextends over the electrode power-supply line 420 to connect to theelectrode power-supply line 420. Accordingly, the opposite electrode 313contacts the protective conductive layer 422 in the peripheral area PA,and the protective conductive layer 422 contacts the electrodepower-supply line 420 in the peripheral area PA.

As shown in FIG. 3, according to an embodiment, since the protectiveconductive layer 422 is disposed on the planarization layer 140, theprotective conductive layer 422 can be formed at the same time and ofthe same materials as that of component disposed on the planarizationlayer 140 in the display area DA. In detail, when the pixel electrode311 in the display area DA is formed on the planarization layer 140, theprotective conductive layer 422 is formed on the planarization layer 140in the peripheral area PA of the same material as that of the pixelelectrode 311 and at the same time as the pixel electrode 311.Accordingly, the protective conductive layer 422 has the same structureas that of the pixel electrode 311. As shown in FIG. 3, the protectiveconductive layer 422 is not covered by the planarization layer 140 butcovers an exposed part of the electrode power-supply line 420. Thus, asdescribed herein, in a process of forming a first restriction dam 610 ora second restriction dam 620, to be described below, damage to theelectrode power-supply line 420 can be prevented.

According to an embodiment, to prevent an impurity such as oxygen,moisture, etc., from penetrating into the display area DA via theplanarization layer 140, the planarization layer 140 has an opening 140b in the peripheral area PA, as shown in FIG. 3. In addition, when theprotective conductive layer 422 is formed, the protective conductivelayer 422 fills the opening 140 b. Thus, when an impurity has penetratedinto the planarization layer 140 in the peripheral area PA, the impuritycan be effectively prevented from penetrating into the planarizationlayer 140 in the display area DA.

According to an embodiment, a capping layer 160 is disposed on theopposite electrode 313, and the capping layer 160 enhances theefficiency of light generated by the organic light-emitting device 310.The capping layer 160 covers the opposite electrode 313 and extendsoutward from the opposite electrode 313 to contact the protectiveconductive layer 422 below the opposite electrode 313. Since theopposite electrode 313 covers the display area DA and extends toward theedge of the display area DA, the capping layer 160 also covers thedisplay area DA up to the boundary of the peripheral area PA outside ofthe display area DA. To enhance light efficiency, the capping layer 160includes one or more organic materials or inorganic materials such assilicon dioxide (SiO₂), silicon nitride (SiNx), zinc peroxide (ZnO₂),titanium dioxide (TiO₂), zirconium dioxide (ZrO₂), indium tin oxide(ITO), indium zinc oxide (IZO), tris-8-hydroxyquinoline aluminum (Alq3),copper phthalocyanine (CuPc), 4,4′-bis(N-carbazolyl)-1,1′-biphenyl(CBP), or N,N′-di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (a-NPB).

As described above, according to an embodiment, the capping layer 160enhances the efficiency of light generated from the organiclight-emitting device 310. For example, the capping layer 160 mayimprove an optical extraction efficiency. The capping layer 160uniformly enhances the efficiency of light in the display area DA. Foruniform enhancement of the efficiency of light, the capping layer 160has an upper surface that conforms to the shape of an upper surface of alayer below the capping layer 160. That is, as shown in FIG. 3, in anarea of the capping layer 160 on the opposite electrode 313, the uppersurface of the capping layer 160 conforms to the shape of an uppersurface of the opposite electrode 313.

According to an embodiment, an encapsulation layer 500 is disposed overthe capping layer 160. The encapsulation layer 500 protects the organiclight-emitting device 310 from external moisture or oxygen. To do so,the encapsulation layer 500 extends over not only the display area DAbut also the peripheral area PA outside of the display area DA. As shownin FIG. 3, the encapsulation layer 500 has a multi-layered structure. Indetail, the encapsulation layer 500 includes a first inorganicencapsulation layer 510, an organic encapsulation layer 520, and asecond inorganic encapsulation layer 530.

According to an embodiment, the first inorganic encapsulation layer 510covers the capping layer 160 and includes at least one of silicon oxide,silicon nitride, or silicon oxynitride, etc. Since the first inorganicencapsulation layer 510 conforms to the structure below, an uppersurface of the first inorganic encapsulation layer 510 is not flat, asshown in FIG. 3.

According to an embodiment, since the organic encapsulation layer 520covers the first inorganic encapsulation layer 510 and is thicker thanthe first inorganic encapsulation layer 510, an upper surface of theorganic encapsulation layer 520 relatively flat over the whole displayarea DA. The organic encapsulation layer 520 includes one or more ofPET, PEN, PC, PI, polyethylene sulfonate, polyoxymethylene,polyacrylate, or HMDSO.

According to an embodiment, the second inorganic encapsulation layer 530covers the organic encapsulation layer 520 and includes at least one ofsilicon oxide, silicon nitride, or silicon oxynitride, etc. The secondinorganic encapsulation layer 530 extends outward from the organicencapsulation layer 520, contacting the first inorganic encapsulationlayer 510 in the peripheral area PA, thus protecting the organicencapsulation layer 520 from being externally exposed.

As such, according to an embodiment, since the encapsulation layer 500includes the first inorganic encapsulation layer 510, the organicencapsulation layer 520, and the second inorganic encapsulation layer530, even when cracks occur in the encapsulation layer 500, the crackswill not connect to each other between the first inorganic encapsulationlayer 510 and the organic encapsulation layer 520 or between the organicencapsulation layer 520 and the second inorganic encapsulation layer530, due to the multi-layered structure of the encapsulation layer 500.Thus, the forming of a path via which external moisture or oxygenpenetrates into the display area DA can be prevented or minimized.

According to an embodiment, when forming the encapsulation layer 500,structures below the encapsulation layer 500 may be damaged. Forexample, the first inorganic encapsulation layer 510 can be formed by achemical vapor deposition method. When the first inorganic encapsulationlayer 510 is formed by chemical vapor deposition, a layer directly belowthe first inorganic encapsulation layer 510 can be damaged. Accordingly,when the first inorganic encapsulation layer 510 is formed directly onthe capping layer 160, if the capping layer 160 is damaged, lightefficiency of the display device 10 can deteriorate. Accordingly, toprevent damage to the capping layer 160 when forming the encapsulationlayer 500, a protective layer 170 is disposed between the capping layer160 and the encapsulation layer 500. The protective layer 170 includeslithium fluoride (LiF).

As described above, according to an embodiment, the capping layer 160extends not only over the display area DA but also into the peripheralarea PA outside the display area DA. Accordingly, the protective layer170 extends toward the edge of the capping layer 160 so that the cappinglayer 160 does not directly contact the encapsulation layer 500. In thiscase, the protective layer 170 covers an end of the capping layer 160 sothat an end of the protective layer 170 is disposed over theplanarization layer 140. In detail, as shown in FIG. 3, the end of theprotective layer 170 directly contacts the protective conductive layer422 over the planarization layer 140.

According to an embodiment, the first inorganic encapsulation layer 510,which is a lowest layer in the encapsulation layer 500, has a greaterbonding strength with a layer formed of an inorganic material than thatwith a layer formed of an organic material. Accordingly, when thecapping layer 160 includes an organic material and the protective layer170 is formed of an inorganic material such as LiF, since the bondingstrength between the inorganic protective layer 170 and the firstinorganic encapsulation layer 510 is greater than that between theorganic capping layer 160 and the first inorganic encapsulation layer510, the encapsulation layer 500 is more strongly bonded with a layerbelow the encapsulation layer 500. Accordingly, in a process ofmanufacturing the display device or using the display device aftermanufacture, delamination of the encapsulation layer 500 from the layerbelow the encapsulation layer 500 can be effectively prevented orminimized.

In detail, according to an embodiment, when the encapsulation layer 500is formed, a material of the organic encapsulation layer 520 needs to beconfined to a predetermined area. To do so, as shown in FIG. 3, thefirst restriction dam 610 is disposed in the peripheral area PA. Indetail, as shown in FIG. 3, the buffer layer 110, the gate insulatinglayer 121, the interlayer insulating layer 131, and the planarizationlayer 140 are disposed in the peripheral area PA as well as in thedisplay area DA of the substrate 101. The first restriction dam 610 isdisposed in the peripheral area PA, separate from the planarizationlayer 140.

According to an embodiment, the first restriction dam 610 has amulti-layered structure. That is, the first restriction dam 610 includesa first layer 611, a second layer 613 and a third layer 615 above thesubstrate 101. The first layer 611 is formed of a same material as thatof the planarization layer 140 and at the same time as the planarizationlayer 140. The second layer 613 is formed of a same material as that ofthe pixel-defining layer 150 and at the same time as the pixel-defininglayer 150. The third layer 615 is formed of a same material as that ofthe pixel-defining layer 150.

As shown in FIG. 3, according to an embodiment, in addition to the firstrestriction dam 610, the second restriction dam 620 is formed betweenthe first restriction dam 610 and the planarization layer 140. Thesecond restriction dam 620 is disposed on a part of the protectiveconductive layer 422 over the electrode power-supply line 420. Thesecond restriction dam 620 is also disposed in the peripheral area PA,separate from the planarization layer 140. The second restriction dam620 has a multi-layered structure like the first restriction dam 610,and includes a lower layer 623 that is simultaneously formed with thesecond layer 613 of the first restriction dam 610 and an upper layer 625disposed on the lower layer 623. Thus, the second restriction dam 620includes fewer layers than the first restriction dam 610 and has aheight from the substrate 101 less than that of the first restrictiondam 610. FIG. 3 shows that the lower layer 623 is formed of a samematerial as that of the second layer 613 of the first restriction dam610 and at same time as the second layer 613, and that the upper layer625 formed from the same material as the third layer 615 of the firstrestriction dam 610.

As shown in FIG. 3, according to an embodiment, when the first inorganicencapsulation layer 510 of the encapsulation layer 500 is formed by achemical vapor deposition, the first inorganic encapsulation layer 510covers the second restriction dam 620 and the first restriction dam 610,thereby extending to the outer edge of the first restriction dam 610.The material for forming the organic encapsulation layer 520 on thefirst inorganic encapsulation layer 510 is confined by the secondrestriction dam 620 to prevent the material from overflowing out fromthe second restriction dam 620 when the organic encapsulation layer 520is formed. Even when some of the material for forming the organicencapsulation layer 520 overflows out from the second restriction dam620, since material of the organic encapsulation layer 520 is alsoconfined by the first restriction dam 610, the material for forming theorganic encapsulation layer 520 does not flow further toward an edge ofthe substrate 101.

As shown in FIG. 3, according to an embodiment, a crack prevention dam630 is disposed in the peripheral area PA. The crack prevention dam 630extends along at least a part of the edge of the substrate 101. Forexample, the crack prevention dam 630 surrounds the whole display areaDA. In some areas, the crack prevention dam 630 may be disconnected.

According to an embodiment, the crack prevention dam 630 can havevarious shapes. As shown in FIG. 3, the crack prevention dam 630 isformed of a same material as that of some components in the display areaDA, and may have a multi-layered structure. FIG. 3 shows the crackprevention dam 630 as having a two-layered structure. In detail, FIG. 3shows that the crack prevention dam 630 includes a lower layer formed ofa same material as the gate insulating layer 121, and an upper layerformed of a same material as the interlayer insulating layer 131 on thegate insulating layer 121. The crack prevention dam 630 is disposed onthe buffer layer 110. As needed, the crack prevention dam 630 may bedisposed on a layer below the buffer layer 110 and include a layerhaving the same material as that of the buffer layer 110. Alternatively,a plurality of the crack prevention dams 630, instead of one crackprevention dam 630, may be disposed, separated from each other.

According to an embodiment, the crack prevention dam 630 is formed byremoving a portion of the gate insulating layer 121 and the interlayerinsulating layer 131. That is, as shown in FIG. 3, a transmissionpreventing groove 632 is formed at least on one side of the crackprevention dam 630 by removing portions of the gate insulating layer 121and the interlayer insulating layer 131. Thus, the crack prevention dam630 includes remaining portions of the gate insulating layer 121 and theinterlayer insulating layer 131 adjacent to the transmission preventinggroove 632.

According to an embodiment, the crack prevention dam 630 is covered by acover layer 650. The cover layer 650 is, for example, formed of a samematerial as that of the planarization layer 140 when the planarizationlayer 140 is formed in the display area DA. That is, the cover layer 650is formed of an organic material that covers the crack prevention dam630, which includes an inorganic material. The cover layer 650 fills thetransmission preventing groove 632 and covers the crack prevention dam630.

FIG. 4 is a schematic plan view of a part A of FIG. 1. FIG. 5 is aschematic cross-sectional view of an example of the display panel 100 ofFIG. 4 taken along a line III-III′.

Referring to FIGS. 4 and 5, according to embodiments, the inputdetection unit 200 of FIG. 1 is disposed directly on the display panel100 of FIG. 1. For example, the input detection unit 200 of FIG. 1 isdisposed directly on the encapsulation layer 500. Accordingly, athickness of the display device 10 of FIG. 1 may be reduced. Forexample, after the input detection unit 200 of FIG. 1 is formed on asubstrate, the substrate is bonded to the encapsulation layer 500.

According to an embodiment, the first detection electrodes 210 and thesecond detection electrodes 230 are formed of a transparent conductivelayer. The transparent conductive layer includes a transparentconductive oxide such as ITO, IZO, ZnO, or indium tin zinc oxide (ITZO),etc. In addition, the transparent conductive layer includes a conductivepolymer such as PEDOT, a metal nano-wire, graphene, etc. For example,the first detection electrodes 210 and the second detection electrodes230 are formed of a transparent metal layer. In this case, the firstdetection electrodes 210 and the second detection electrodes 230 areformed as a mesh form to be transparent.

According to an embodiment, two first detection electrodes 210 adjacentto each other along the first direction D1 are connected to each othervia a connector 220. The connector 220 is disposed on a same layer asthat of the first detection electrode 210. The connector 220 isintegrally formed with the first detection electrodes 210.

According to an embodiment, two second detection electrodes 230 adjacentto each other along the second direction D2 perpendicular to the firstdirection D1 are connected to each other via a bridge wire 240. Thebridge wire 240 is disposed on a different layer from that of the firstand second detection electrodes 210 and 230. For example, the bridgewire 240 is disposed on the encapsulation layer 500, a first insulatinglayer 201 is disposed on the bridge wire 240, and the first and seconddetection electrodes 210 and 230 are disposed over the first insulatinglayer 201. In this case, the bridge wire 240 is electrically connectedto the second detection electrodes 230 via first contact holes CNT-I inthe first insulating layer 201. In addition, a second insulating layer202 is disposed over the first and second detection electrodes 210 and230.

According to an embodiment, since the bridge wire 240 crosses theconnector 220, a width of the bridge wire 240, when measured in a plane,is minimized to reduce parasitic capacitance between the bridge wire 240and the connector 220. In addition, the bridge wire 240 includes amaterial having a lower resistance than the second detection electrodes230 to enhance sensing sensitivity. For example, the bridge wire 240includes one or more of Mo, Ag, Ti, Cu, or Al, or an alloy thereof.

According to an embodiment, at least one of the first insulating layer201 and the second insulating layer 202 includes an inorganic layer. Theinorganic layer is at least one of aluminum oxide, titanium oxide,silicon oxide, silicon oxynitride, zirconium oxide, or hafnium oxide.

According to an embodiment, at least one of the first insulating layer201 and the second insulating layer 202 includes an organic layer. Theorganic layer is at least one of an acrylic-based resin, a methacrylic-based resin, polyisoprene, a vinyl-based resin, an epoxy-basedresin, a urethane-based resin, a cellulose-based resin, a siloxane-basedresin, a polyimide-based resin, a polyamide-based resin, or aperylene-based resin.

According to an embodiment, the first insulating layer 201 and thesecond insulating layer 202 are disposed over the whole display area DAof the display panel 100, and the input detection unit 200 is disposedon the display panel 100. Thus, a refractive index of the firstinsulating layer 201 is less than that of the second insulating layer202, thus enhancing the optical extraction efficiency of the displaypanel 100 of FIG. 2.

FIGS. 4 and 5 show an embodiment in which the bridge wire 240 isdisposed on a layer below that of the connector 220. However,embodiments of the present disclosure are not limited thereto, and thebridge wire 240 may be disposed on a layer above that of the connector220. In addition, two or more bridge wire 240 may be used.

In addition, according to an embodiment, a floating dummy pattern thatis not connected to the first detection electrode 210 or the seconddetection electrode 230 is further disposed between the first detectionelectrode 210 and the second detection electrode 230. Since the dummypattern is disposed in a same layer as that of the first detectionelectrode 210 and the second detection electrode 230, visibility of aborder between the first detection electrode 210 and the seconddetection electrode 230 is reduced.

FIG. 6 is a schematic plan view of a part B of FIG. 1. FIG. 17 is aschematic plan view of a part C of FIG. 6. FIG. 8 is a schematiccross-sectional view of an example of the display panel 100 of FIG. 7taken along lines IV-IV′. Hereinafter, a description is provided withreference to FIGS. 1 and 6 to 8. In addition, for convenience ofdescription, an area in which the first detection electrodes 210 and thesecond detection electrodes 230 are disposed is referred to as a toucharea TA.

Referring to FIGS. 1 and 6 to 8, according to an embodiment, the firstdetection electrode array 210-1 has a section cut out by the concaveportion T. Accordingly, the first detection electrodes 210 of the firstdetection electrode array 210-1 on both sides of the concave portion Tare electrically connected to each other by the connection wire 250. Theconnection wire 250 is disposed over the encapsulation layer 500 outsidethe touch area TA.

According to an embodiment, the connection wire 250 includes a pluralityof segments 251 separate from each other and conjunction portions 260that electrically connect two adjacent segments 251.

According to an embodiment, the plurality of segments 251 are disposedon a same layer as that of the bridge wire 240 shown in and describedwith reference to FIGS. 4 and 5, and include a same material as that ofthe bridge wire 240 of FIG. 4. In addition, the conjunction portions 260are disposed on a same layer as that of the first and second detectionelectrodes 210 and 230, and include a same material as that of the firstand second detection electrodes 210 and 230.

Accordingly, in an embodiment, the plurality of segments 251 aredisposed on the encapsulation layer 500, the first insulating layer 201is disposed on the plurality of segments 251, and the conjunctionportion 260 is disposed on the first insulating layer 201. In this case,the conjunction portions 260 are electrically connected to the pluralityof segments 251 via a second contact holes CNT-II in the firstinsulating layer 201. In addition, the second insulating layer 202 isdisposed on the conjunction portions 260.

As such, according to an embodiment, when the connection wire 250includes a plurality of segments 251, the amount of electric chargesaccumulated in the connection wire 250 is reduced as compared to whenthe connection wire 250 is formed as one body. Accordingly, a phenomenonin which the first insulating layer 201 or the second insulating layer202 are destroyed when the accumulated electric charges are dischargedcan be prevented, and damage to the input detection unit 200 can beprevented or reduced.

According to an embodiment, the input detection unit 200 includes aconnection line CL that connects the first detection electrodes 210 orthe second detection electrodes 230 to a pad, and dummy lines DL in afloating state are disposed in a periphery of the touch area TA. Thatis, by placing the dummy lines DL in an empty space in the periphery ofthe touch area TA, visibility of the connection line CL can be reduced.In addition, since the connection line CL, the dummy lines DL, and theplurality of segments 251 are disposed on a same layer, the dummy linesDL are disposed between the connection line CL and the plurality ofsegments 251 to prevent a short circuit between the connection line CLand the plurality of segments 251.

FIGS. 9 and 10 are schematic plan views of other examples of part C ofFIG. 6.

Referring to FIGS. 9 and 10, according to an embodiment, the connectionline CL, the dummy lines DL, and the segments 251 are disposed outsidethe touch area TA. The dummy lines DL disposed between the connectionline CL and the segments 251 include a cut portion CP of which a part isremoved. The segments 251 include expanded portions 252 that extend fromends of the segment 251 into the cut portion CP. The expanded portions252 may be wider than a width of the segments 251. In addition, aconnector 262 that connects the segments 251 with each other is disposedthat overlaps the expanded portion 252. A contact hole that connects theconnector 262 to the expanded portion 252 is larger than that of thesecond contact hole CNT-II of FIG. 8. Alternatively, the connector 262is connected to the expanded portion 252 via a plurality of contactholes.

As described above, according to an embodiment, a width of theconnection wire 250 needs to be adjusted so that a resistance value ofthe first detection electrode array 210-1 that includes the pair offirst detection electrodes 210 electrically connected to each other viathe connection wire 250 is equal to that of the other first detectionelectrode array 210-2 in which the first detection electrodes 210 areconsecutively disposed. Accordingly, the segments 251 include theexpanded portion 252 so that, even when a width of the connection wire250 is small, the first detection electrode array 210-1 has a sameresistance as that of the other first detection electrode array 210-2.

According to embodiments, since a connection wire that connects firstdetection electrodes on both sides of a concave portion of a displaydevice includes a plurality of segments, the amount of electric chargesaccumulated in the connection wire is reduced, thereby preventing aninput detection unit from being damaged by electrostatic discharge.However, embodiments of the present disclosure are not limited thereto.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.

What is claimed is:
 1. A display device, comprising: a display panelthat includes a concave portion at a side of the display panel; and aninput detection unit disposed over the display panel, wherein the inputdetection unit includes a plurality of first detection electrodeselectrically connected to each other in a first direction, a pluralityof second detection electrodes electrically connected to each other in asecond direction perpendicular to the first direction, wherein theplurality of first detection electrodes and the plurality of seconddetection electrodes are configured to detect a contact with an externaltouch unit, and a connection wire that electrically connects a pair ofthe first detection electrodes disposed at both sides of the concaveportion, wherein the connection wire includes a plurality of segmentsseparate from each other and conjunction portions that electricallyconnect two adjacent segments to each other, and the conjunctionportions are disposed on a same layer as that of the first detectionelectrodes and the second detection electrodes, and the plurality ofsegments are disposed on a different layer from that of the seconddetection electrodes.
 2. The display device of claim 1, wherein theinput detection unit further comprises a connector that connects twoadjacent first detection electrodes, and a bridge electrode that connecttwo adjacent second detection electrodes, the connector is disposed on asame layer as that of the first detection electrodes and the seconddetection electrodes, and the bridge electrode is disposed on adifferent layer from that of the second detection electrodes, and theplurality of segments are disposed on a same layer as that of the bridgeelectrode.
 3. The display device of claim 2, wherein the input detectionunit further comprises a first insulating layer between the bridgeelectrode and the second detection electrodes and between the segmentsand the conjunction portion, and the bridge electrode is connected tothe second detection electrodes via first contact holes formed in thefirst insulating layer, and the segments are connected to theconjunction portions via second contact holes formed in the firstinsulating layer.
 4. The display device of claim 3, wherein the bridgeelectrode is disposed on a layer that is lower than that of the seconddetection electrodes, the input detection unit further comprises asecond insulating layer disposed over the conjunction portion, and arefractive index of the first insulating layer is less than a refractiveindex of the second insulating layer.
 5. The display device of claim 1,wherein the input detection unit comprises a touch area in which theplurality of first detection electrodes and the plurality of seconddetection electrodes are disposed, and the connection wire is disposedoutside the touch area.
 6. The display device of claim 5, wherein theinput detection unit comprises a connection line connected to theplurality of first detection electrodes or the plurality of seconddetection electrodes, and a dummy line in a floating state, wherein theconnection line and the dummy line are disposed outside the touch area,and the dummy line is disposed between the connection line and theconnection wire.
 7. The display device of claim 6, wherein the dummyline comprises a cut portion obtained by removing a part of the dummyline, and the plurality of segments respectively further comprise anexpanded portion that extends from an end of the plurality of segmentsinto the cut portion.
 8. The display device of 1, wherein the inputdetection unit is disposed directly on the display panel.
 9. The displaydevice of claim 1, wherein the display panel comprises an organiclight-emitting device.
 10. A display device, comprising: a display panelthat includes a concave portion at a side of the display panel; and aninput detection unit disposed over the display panel, wherein the inputdetection unit includes a plurality of first detection electrode arraysin which a plurality of first detection electrodes are electricallyconnected to each other and extend parallel to each other in a firstdirection, and the plurality of first detection electrode arrays arespaced apart from each other in a second direction perpendicular to thefirst direction, a first detection electrode array of the plurality offirst detection electrode arrays is cut by the concave portion andincludes a pair of first detection electrodes disposed at both sides ofthe concave portion, and the pair of first detection electrodes areelectrically connected to each other via a connection wire that bypassesthe concave portion, and a resistance value of the cut first detectionelectrode array is identical to a resistance value of other detectionelectrode arrays of the plurality of first detection electrode arrays inwhich the first detection electrodes are consecutively disposed.
 11. Thedisplay device of claim 10, wherein the connection wire comprises aplurality of separate segments, and conjunction portions thatelectrically connect adjacent segments of the plurality of separatesegments to each other.
 12. The display device of claim 11, wherein theinput detection unit comprises a touch area in which the plurality offirst detection electrodes are disposed, and the connection wire isdisposed outside the touch area.
 13. The display device of claim 12,wherein the input detection unit further comprises a plurality of seconddetection electrodes electrically connected to each other in the seconddirection.
 14. The display device of claim 13, wherein the inputdetection unit further comprises a connection line connected to theplurality of first detection electrodes or the plurality of seconddetection electrodes, and a dummy line in a floating state that aredisposed outside the touch area, wherein the dummy line is disposedbetween the connection line and the connection wire.
 15. The displaydevice of claim 14, wherein the dummy line comprises a cut portionobtained by removing a part of the dummy line, and the plurality ofseparate segments further comprise expanded portions that extend fromthe end of the plurality of separate segments into the cut portion. 16.The display device of claim 11, wherein the input detection unit furthercomprises a connector that connects two adjacent first detectionelectrodes, and a bridge electrode that connect two adjacent seconddetection electrodes, wherein the connector is disposed on a same layeras that of the first detection electrodes and the second detectionelectrodes, and the bridge electrode is disposed on a different layerfrom that of the second detection electrodes, and the conjunctionportion is disposed on a same layer as that of the first detectionelectrodes and the second detection electrodes, and the plurality ofseparate segments are disposed on a same layer as that of the bridgeelectrode.
 17. The display device of claim 16, wherein the inputdetection unit further comprises a first insulating layer between thebridge electrode and the second detection electrodes, and between theplurality of separate segments and the connector, wherein the bridgeelectrode is connected to the second detection electrodes via firstcontact holes formed in the first insulating layer, and the plurality ofseparate segments are connected to the connector via second contactholes formed in the first insulating layer.
 18. The display device ofclaim 17, wherein the bridge electrode is disposed on a layer lower thanthat of the second detection electrodes, the input detection unitfurther comprises a second insulating layer disposed over theconjunction portion, and a refractive index of the first insulatinglayer s than a refractive index of the second insulating layer.
 19. Thedisplay device of claim 10, wherein the display panel comprises anorganic light-emitting device and an encapsulation layer that protectsthe organic light-emitting device, and the input detection unit isdisposed directly on the encapsulation layer.
 20. A display device,comprising: a display panel that includes a concave portion at a side ofthe display panel; and an input detection unit disposed over the displaypanel, wherein the input detection unit includes a plurality of firstdetection electrodes electrically connected to each other in a firstdirection and spaced apart from each other in a second directionperpendicular to the first direction, a plurality of second detectionelectrodes electrically connected to each other in the second direction,wherein the plurality of first detection electrodes and the plurality ofsecond detection electrodes are configured to detect a contact with anexternal touch unit, a connection wire that electrically connects a pairof the first detection electrodes disposed at both sides of the concaveportion that are separated by the concave portion, a connector thatconnects two adjacent first detection electrodes, and a bridge electrodethat connect two adjacent second detection electrodes, wherein theconnector is disposed on a same layer as that of the first detectionelectrodes and the second detection electrodes, and the bridge electrodeis disposed on a different layer from that of the second detectionelectrodes.